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| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
PLCC-20-ATPLCC 20P THROUGH HOLE |
5,883 | 1.23 |
FFQ |
Datasheet |
Tube | PLCC | Active | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-628-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 28P |
5,528 | 1.36 |
FFQ |
Datasheet |
Tube | ICM | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
PLCC-32-ATPLCC 32P THROUGH HOLE |
9,472 | 1.36 |
FFQ |
Datasheet |
Tube | PLCC | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-328-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 28P |
6,913 | 1.44 |
FFQ |
Datasheet |
Tube | ICM | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
PLCC-68-AT-SMTCONN SOCKET PLCC 68POS PHOS BRNZ |
8,806 | 1.45 |
FFQ |
Datasheet |
Tube | PLCC | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-632-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 32P |
8,290 | 1.46 |
FFQ |
Datasheet |
Tube | ICM | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
PLCC-84-ATPLCC 84P THROUGH HOLE |
7,759 | 1.59 |
FFQ |
Datasheet |
Tube | PLCC | Active | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-640-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 40P |
7,162 | 1.70 |
FFQ |
Datasheet |
Tube | ICM | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
ICM-648-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 48P |
7,693 | 2.04 |
FFQ |
Datasheet |
Tube | ICM | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
PLCC-52-ATPLCC 52P THROUGH HOLE |
9,876 | 2.13 |
FFQ |
Datasheet |
Tube | PLCC | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
PLCC-68-ATPLCC 68P THROUGH HOLE |
7,095 | 2.27 |
FFQ |
Datasheet |
Tube | PLCC | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-324-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 24P |
8,908 | 1.31 |
FFQ |
Datasheet |
Tube | ICM | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
PLCC-84-AT-SMTPLCC SOCKET 84P SMT |
7,597 | 2.01 |
FFQ |
Datasheet |
Tube | PLCC | Active | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICS-316-TIC SOCKET, DIP, 16P 2.54MM PITCH |
12,531 | 0.18 |
FFQ |
Datasheet |
Tube | ICS | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICS-624-TIC SOCKET, DIP, 24P 2.54MM PITCH |
10,999 | 0.27 |
FFQ |
Datasheet |
Tube | ICS | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
ICM-314-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 14P |
12,401 | 0.80 |
FFQ |
Datasheet |
Tube | ICM | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
|
ICM-316-1-GT-HTMACHINE PIN SOCKET, IC, DIP, 16P |
10,506 | 0.91 |
FFQ |
Datasheet |
Tube | ICM | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Polyphenylene Sulfide (PPS) |
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