Загрузить BOM
400-966-0015
sales@cooltat.com.hk
Добро пожаловать в COOLTAT INDUSTRIAL (HK) CO.,LIMITED
| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
115-87-314-41-001101CONN IC DIP SOCKET 14POS GOLD |
14,598 | 0.52 |
FFQ |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
510-83-012-05-001101CONN SOCKET PGA 12POS GOLD |
14,343 | 0.52 |
FFQ |
Datasheet |
Bulk | 510 | Active | PGA | 12 (5 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
917-87-104-41-005101CONN TRANSIST TO-5 4POS GOLD |
12,920 | 0.55 |
FFQ |
Datasheet |
Bulk | 917 | Active | Transistor, TO-5 | 4 (Round) | - | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | - | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
917-87-104-41-053101CONN TRANSIST TO-5 4POS GOLD |
11,571 | 0.55 |
FFQ |
Datasheet |
Bulk | 917 | Active | Transistor, TO-5 | 4 (Round) | - | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | - | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-306-41-012101CONN IC DIP SOCKET 6POS GOLD |
14,094 | 0.53 |
FFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
917-87-103-41-005101CONN TRANSIST TO-5 3POS GOLD |
11,523 | 0.37 |
FFQ |
Datasheet |
Bulk | 917 | Active | Transistor, TO-5 | 3 (Round) | - | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | - | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
917-87-103-41-053101CONN TRANSIST TO-5 3POS GOLD |
10,332 | 0.37 |
FFQ |
Datasheet |
Bulk | 917 | Active | Transistor, TO-5 | 3 (Round) | - | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | - | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-306-31-012101CONN IC DIP SOCKET 325POS GOLD |
14,466 | 0.36 |
FFQ |
Datasheet |
Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 325 (18 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
115-87-210-41-001101CONN IC DIP SOCKET 10POS GOLD |
11,052 | 0.36 |
FFQ |
Bulk | 115 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
115-87-310-41-001101CONN IC DIP SOCKET 10POS GOLD |
11,864 | 0.37 |
FFQ |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
116-87-304-41-001101CONN IC DIP SOCKET 4POS GOLD |
11,163 | 0.36 |
FFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-306-41-003101CONN IC DIP SOCKET 6POS GOLD |
10,224 | 0.36 |
FFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-83-306-41-003101CONN IC DIP SOCKET 6POS GOLD |
12,633 | 0.36 |
FFQ |
Datasheet |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
122-83-304-41-001101CONN IC DIP SOCKET 4POS GOLD |
12,492 | 0.37 |
FFQ |
Datasheet |
Bulk | 122 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
123-83-304-41-001101CONN IC DIP SOCKET 4POS GOLD |
14,564 | 0.37 |
FFQ |
Datasheet |
Bulk | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-610-41-001101CONN IC DIP SOCKET 10POS GOLD |
10,341 | 0.37 |
FFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-87-610-41-001101CONN IC DIP SOCKET 10POS GOLD |
14,061 | 0.37 |
FFQ |
Bulk | 115 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
116-83-304-41-007101CONN IC DIP SOCKET 4POS GOLD |
14,090 | 0.37 |
FFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
146-83-304-41-035101CONN IC DIP SOCKET 4POS GOLD |
13,104 | 0.38 |
FFQ |
Datasheet |
Bulk | 146 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
146-83-304-41-036101CONN IC DIP SOCKET 4POS GOLD |
14,630 | 0.38 |
FFQ |
Datasheet |
Bulk | 146 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Request a Quote
