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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фотографии Производитель. Часть # Доступность Цены Количество Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
114-87-624-41-117101

114-87-624-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

5,455 1.00
- +

FFQ

114-87-624-41-117101

Datasheet

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-87-624-41-134161

114-87-624-41-134161

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

8,926 1.00
- +

FFQ

114-87-624-41-134161

Datasheet

Bulk 114 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-310-41-035101

146-83-310-41-035101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

8,263 1.00
- +

FFQ

146-83-310-41-035101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-310-41-036101

146-83-310-41-036101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

9,537 1.00
- +

FFQ

146-83-310-41-036101

Datasheet

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-105101

110-87-320-41-105101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

7,899 1.00
- +

FFQ

110-87-320-41-105101

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-420-41-001101

614-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

5,884 1.00
- +

FFQ

614-87-420-41-001101

Datasheet

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-006101

116-83-314-41-006101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

5,724 1.01
- +

FFQ

116-83-314-41-006101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-320-41-001101

614-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

5,967 1.00
- +

FFQ

614-87-320-41-001101

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-002101

116-83-210-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

7,663 1.01
- +

FFQ

116-83-210-41-002101

Datasheet

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-002101

116-83-310-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

5,417 1.01
- +

FFQ

116-83-310-41-002101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-308-41-002101

124-83-308-41-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

9,097 1.01
- +

FFQ

Bulk 124 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-018101

116-83-210-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

6,304 1.05
- +

FFQ

116-83-210-41-018101

Datasheet

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-306-41-105191

110-83-306-41-105191

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

8,402 1.05
- +

FFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-316-41-105101

117-87-316-41-105101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

8,623 1.01
- +

FFQ

117-87-316-41-105101

Datasheet

Bulk 117 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-316-41-105191

110-87-316-41-105191

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

7,909 1.06
- +

FFQ

Tape & Reel (TR) 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-624-41-003101

115-87-624-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

8,677 1.02
- +

FFQ

115-87-624-41-003101

Datasheet

Bulk 115 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-318-41-117101

114-83-318-41-117101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

9,657 1.05
- +

FFQ

114-83-318-41-117101

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-318-41-134161

114-83-318-41-134161

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

7,253 1.05
- +

FFQ

114-83-318-41-134161

Datasheet

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-009101

116-87-312-41-009101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

7,296 1.02
- +

FFQ

116-87-312-41-009101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-41-105161

110-83-314-41-105161

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

9,723 1.02
- +

FFQ

110-83-314-41-105161

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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