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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фотографии Производитель. Часть # Доступность Цены Количество Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-87-428-41-005101

117-87-428-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

9,038 1.06
- +

FFQ

117-87-428-41-005101

Datasheet

Bulk 117 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-028-24-008

540-88-028-24-008

CONN SOCKET PLCC 28POS TIN

Preci-Dip

9,690 1.06
- +

FFQ

540-88-028-24-008

Datasheet

Bulk 540 Active PLCC 28 (4 x 7) 0.050 (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
116-83-210-41-003101

116-83-210-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

6,334 1.10
- +

FFQ

116-83-210-41-003101

Datasheet

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-632-41-605101

110-87-632-41-605101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

7,600 1.20
- +

FFQ

110-87-632-41-605101

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-432-41-005101

110-87-432-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

9,002 1.06
- +

FFQ

110-87-432-41-005101

Datasheet

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-632-41-005101

110-87-632-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

7,208 1.20
- +

FFQ

110-87-632-41-005101

Datasheet

Bulk 110 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-040-11-061101

510-87-040-11-061101

CONN SOCKET PGA 40POS GOLD

Preci-Dip

9,083 1.24
- +

FFQ

510-87-040-11-061101

Datasheet

Bulk 510 Active PGA 40 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-316-41-012101

116-87-316-41-012101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

6,127 1.10
- +

FFQ

116-87-316-41-012101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-610-41-008101

116-83-610-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

8,386 1.07
- +

FFQ

116-83-610-41-008101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-011101

116-87-610-41-011101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

8,550 1.07
- +

FFQ

116-87-610-41-011101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-320-41-105161

110-87-320-41-105161

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

7,592 1.08
- +

FFQ

110-87-320-41-105161

Datasheet

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-320-41-006101

116-87-320-41-006101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

7,309 1.08
- +

FFQ

116-87-320-41-006101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-428-41-001101

115-87-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

8,770 1.08
- +

FFQ

Bulk 115 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-009101

116-83-210-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

6,924 1.08
- +

FFQ

116-83-210-41-009101

Datasheet

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-009101

116-83-310-41-009101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

8,308 1.08
- +

FFQ

116-83-310-41-009101

Datasheet

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-108-41-005101

917-83-108-41-005101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

5,772 1.12
- +

FFQ

917-83-108-41-005101

Datasheet

Bulk 917 Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-108-41-053101

917-83-108-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

8,935 1.12
- +

FFQ

917-83-108-41-053101

Datasheet

Bulk 917 Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-208-41-005101

917-83-208-41-005101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

7,358 1.12
- +

FFQ

917-83-208-41-005101

Datasheet

Bulk 917 Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
917-83-208-41-053101

917-83-208-41-053101

CONN TRANSIST TO-5 8POS GOLD

Preci-Dip

9,987 1.12
- +

FFQ

917-83-208-41-053101

Datasheet

Bulk 917 Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-316-41-001101

614-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

7,863 1.09
- +

FFQ

614-83-316-41-001101

Datasheet

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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