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| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
508-AG11D-ESCONN IC DIP SOCKET 8POS GOLD |
2,520 | 2.02 |
FFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
1825575-2CONN IC DIP SOCKET 8POS TIN |
6,727 | 2.52 |
FFQ |
Datasheet |
Tape & Reel (TR),Bulk | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Thermoplastic, Polyester |
|
808-AG11DCONN IC DIP SOCKET 8POS GOLD |
3,258 | 2.76 |
FFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester |
|
|
2-1814640-0CONN IC DIP SOCKET 16POS TIN |
9,903 | 2.88 |
FFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester |
|
4-1571552-9CONN IC DIP SOCKET 28POS GOLD |
3,362 | 3.43 |
FFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
828-AG12D-ES-LFCONN IC DIP SOCKET 28POS TIN |
2,368 | 4.33 |
FFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole, Right Angle, Vertical | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
828-AG11D-ESCONN IC DIP SOCKET 28POS GOLD |
3,343 | 4.59 |
FFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
5-1571552-2CONN IC DIP SOCKET 40POS GOLD |
2,475 | 4.77 |
FFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
824-AG11DCONN IC DIP SOCKET 24POS GOLD |
9,975 | 6.28 |
FFQ |
Datasheet |
Tube | 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
|
1825088-3CONN IC DIP SOCKET 14POS GOLD |
7,701 | 6.57 |
FFQ |
Datasheet |
Tube | 500 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | Thermoplastic |
|
|
824-AG30DCONN IC DIP SOCKET 24POS GOLD |
6,897 | 7.10 |
FFQ |
Datasheet |
Tube | 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | - | Polyester |
|
528-AG11DCONN IC DIP SOCKET 28POS GOLD |
3,752 | 8.10 |
FFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
540-AG10D-ESCONN IC DIP SOCKET 40POS GOLD |
3,829 | 8.37 |
FFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass | - |
|
|
8080-1G16-LFCONN TRANSIST TO-3 3POS SILVER |
8,443 | 9.01 |
FFQ |
Datasheet |
Bulk | 8080 | Active | Transistor, TO-3 | 3 (Oval) | - | Silver | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Silver | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
5-6437504-0CONN TRANSIST TO-3 3POS SILVER |
9,811 | 8.54 |
FFQ |
Bulk,Box | 8080 | Active | Transistor, TO-3 | 3 (Oval) | - | Silver | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Silver | - | Beryllium Copper | Diallyl Phthalate (DAP) | |
|
|
8080-1G45CONN TRANSIST TO-3 3POS TIN |
2,054 | 10.52 |
FFQ |
Bulk | 8060 | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) | |
|
|
8080-1G14CONN SOCKET TRANSIST TO-3 3POS |
3,176 | 11.40 |
FFQ |
Datasheet |
Bulk | 8080 | Active | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Phenolic |
|
|
8080-1G17CONN TRANSIST TO-3 3POS TIN |
4,801 | 11.73 |
FFQ |
Datasheet |
Bulk | 8060 | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
8080-1G31CONN TRANSIST TO-3 3POS TIN |
1,701 | 13.21 |
FFQ |
Datasheet |
Bulk | 8060 | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | - | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | - | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
9-1437504-1CONN TRANSIST TO-3 3POS GOLD |
4,475 | 13.91 |
FFQ |
Datasheet |
Bulk | 8080 | Active | Transistor, TO-3 | 3 (Oval) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
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