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| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
9-1437504-7CONN TRANSIST TO-3 3POS TIN |
4,384 | 14.82 |
FFQ |
Datasheet |
Bulk | 8080 | Active | Transistor, TO-3 | 3 (Oval) | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polytetrafluoroethylene (PTFE) |
|
|
3-1437508-1CONN TRANSIST TO-5 8POS GOLD |
3,573 | 17.79 |
FFQ |
Bulk,Bulk | 8058 | Active | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) | |
|
3-1437508-6CONN TRANSIST TO-5 8POS GOLD |
3,937 | 19.86 |
FFQ |
Datasheet |
Bulk,Box | 8058 | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) |
|
8080-1G9CONN TRANSIST TO-3 4POS GOLD |
1,880 | 20.51 |
FFQ |
Datasheet |
Bulk | 8080 | Active | Transistor, TO-3 | 4 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Fluoropolymer (FP) |
|
1554653-1CONN SOCKET LGA 2011POS GOLD |
3,953 | 22.07 |
FFQ |
Datasheet |
Tray | - | Last Time Buy | LGA | 2011 (47 x 58) | - | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | Gold | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic |
|
|
1-1554653-1CONN SOCKET LGA 2011POS GOLD |
3,114 | 26.69 |
FFQ |
Datasheet |
Tray,Box | - | Last Time Buy | LGA | 2011 (47 x 58) | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | Gold | 30.0µin (0.76µm) | Copper Alloy | Thermoplastic |
|
|
1437522-4CONN SOCKET PGA 321POS GOLD |
1,799 | 35.74 |
FFQ |
Datasheet |
Bulk | - | Active | PGA | 321 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Thermoplastic, Polyester |
|
|
6-1437522-9STAMPED PIN |
2,657 | 72.05 |
FFQ |
Bulk,Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
2-641296-4CONN IC DIP SOCKET 6POS GOLD |
2,843 | 0.35 |
FFQ |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | |
|
2-640463-4CONN IC DIP SOCKET 8POS GOLD |
2,639 | 0.00 |
FFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-640357-4CONN IC DIP SOCKET 14POS GOLD |
2,667 | 0.00 |
FFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-640358-4CONN IC DIP SOCKET 16POS GOLD |
3,417 | 0.00 |
FFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-640359-4CONN IC DIP SOCKET 18POS GOLD |
3,085 | 0.00 |
FFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic |
|
2-640464-4CONN IC DIP SOCKET 20POS GOLD |
3,174 | 0.00 |
FFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-640361-4CONN IC DIP SOCKET 24POS GOLD |
2,615 | 1.53 |
FFQ |
Datasheet |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Beryllium Copper | Thermoplastic |
|
2-640362-4CONN IC DIP SOCKET 28POS GOLD |
3,551 | 0.00 |
FFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-640379-4CONN IC DIP SOCKET 40POS GOLD |
3,910 | 0.00 |
FFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
|
2-916783-5CONN SOCKET PGA ZIF 370POS GOLD |
2,302 | 0.00 |
FFQ |
Datasheet |
Tray | - | Obsolete | PGA, ZIF (ZIP) | 370 (19 x 19) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
5-916783-2CONN SOCKET PGA ZIF 370POS GOLD |
2,834 | 0.00 |
FFQ |
Datasheet |
Tray | - | Obsolete | PGA, ZIF (ZIP) | 370 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
1-916783-5CONN SOCKET PGA ZIF 370POS GOLD |
3,266 | 0.00 |
FFQ |
Datasheet |
Tray | - | Obsolete | PGA, ZIF (ZIP) | 370 (19 x 19) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
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